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Thursday, October 18 • 8:00am - 9:30am
APT6: Reliability of Intermetallics in Various Interconnects

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Chair: *Burton Carpenter, NXP Semiconductors
Co-Chair: *Don Banks, Abbott

>>Comparison of Reliability of Copper, Gold, Silver, and PCC Wirebonds Under Sustained Operation at 200C
*Pradeep Lall, Ph.D., Shantanu Deshpande, Luu Nguyen, Auburn University

>>Copper-Tin Intermetallics: Their Importance, Growth Rate, and Nature
*Ron Lasky, Ph.D., Indium Corporation

>>The Role of Nickel in Solder Alloys - Part 2. The Effect of Ni on The Integrity of The Interfacial Intermetallic in Sn-Based Solder Joints to Copper Substrates
Kazuhiro Nogita, The University of Queensland; Keith Sweatman; Tetsuro Nishimura, Nihon Superior Co. Ltd.

Thursday October 18, 2018 8:00am - 9:30am CDT
Room 44