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Wednesday, October 17 • 1:00pm - 3:00pm
APT5: Advances in Technology for Power Packaging

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Chair: *Marie Cole, IBM Corporation
Co-Chair: *Jim Wilcox, Universal Instruments Corporation

>>New Soldering Technology for High Temperature Applications: Hot Powder Connection (HotPowCon)
Steffen Käss, *Jörg Trodler, S. Fritzsche, D.Feil, T.Herberholz, Heraeus Deutschland GmbH & Co.KG

>>Liquid Dispensed Thermal Interface Materials for Electronics Applications  
John Timmerman, Ph.D., Henkel

>>Investigation of Copper Sinter Material for Die Attach
*Christian Schwarzer, Heraeus Deutschland GmbH

Wednesday October 17, 2018 1:00pm - 3:00pm CDT
Room 44