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Wednesday, October 17 • 10:30am - 12:00pm
APT4: Board Level Reliability

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Chair: Brian Roggeman, Qualcomm Technologies Inc.
Co-Chair: Thomas Zanatta, Zebra Technologies

>>Solder-Joint Reliability of a 0.65mm Molded Array Package for Automotive Applications
*Burton Carpenter, Mollie Benson; *Andrew Mawer, NXP Semiconductors

>>Characterization of SiP Assembly and Reliability Under Thermal Cycles
Jim Wilcox, Universal Instruments Corporation

>>Effective Approach to Enhance The Shock Performance of Ultra-large BGA Components
 Cherif Guirguis, Weidong Xie, Ph.D., Mudasir Ahmad, Gnyaneshwar Ramakrishna, Jianghai Gu, Cisco Systems

Wednesday October 17, 2018 10:30am - 12:00pm CDT
Room 44