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Wednesday, October 17 • 8:00am - 10:00am
APT3: Package Warpage Effects on Assembly and Reliability

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Chair: Robert Darveaux, Skyworks Solutions, Inc
Co-Chair: Steve Murray, Northrup Gumman

>>Effect of Package Warpage and Expansion Characteristics on Failure Modes in Board-Level Thermal Cycling
*Andrew Mawer, NXP Semiconductors

>>Warpage of Flexible-Board Assemblies with BGAs During Reflow and Post-Assembly Usage
*Pradeep Lall, Ph.D., Auburn University

>>Thermal Shadow Moiré to Cross-Section Correlation Study
Jorge Arellano, Steven Perng, Cisco Systems; Edgardo Alvarez, Jabil Mexico;  Neil Hubble, Akrometrix

Wednesday October 17, 2018 8:00am - 10:00am CDT
Room 44