Chair: Robert Darveaux, Skyworks Solutions, Inc Co-Chair: Steve Murray, Northrup Gumman
>>Effect of Package Warpage and Expansion Characteristics on Failure Modes in Board-Level Thermal Cycling *Andrew Mawer, NXP Semiconductors
>>Warpage of Flexible-Board Assemblies with BGAs During Reflow and Post-Assembly Usage *Pradeep Lall, Ph.D., Auburn University
>>Thermal Shadow Moiré to Cross-Section Correlation Study Jorge Arellano, Steven Perng, Cisco Systems; Edgardo Alvarez, Jabil Mexico; Neil Hubble, Akrometrix
Wednesday October 17, 2018 8:00am - 10:00am CDT
Room 44
