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Tuesday, October 16 • 1:30pm - 3:30pm
APT2: Assembly and Reliability of Bottom Termination Components

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Chair: *Pradeep Lall, Auburn University
Co-Chair: Satyajit Walwadkar, Ph.D., Intel Corporation

>>The Influence of Printed Circuit Board Thickness on the Thermal Fatigue Reliability of Quad Flat No-Lead Packages
*Richard Coyle,Ph.D., Nokia Bell Labs; David Ihms, Jagadeesh Radhakrishnan; *Neil Hubble, Akrometrix; Jesse deWitt; Charmaine Johnson; Jeffrey Lee; iST-Integrated Service Technology Inc.; Greg Wu; Grace O’Malley, iNEMI

>>As-Shipped Height vs. Mounted Height for LGA and BGA Packages
*Robert Darveaux, Ph.D.,Robert Skyworks; Howard Chen; Shaul Branchevsky; Mahendra Harsha

>>Reliability of TSOP/QFN/Passive Assemblies Under Harsh and LN2 Thermal Cycles
*Reza Ghaffarian, Ph.D., JPL

Tuesday October 16, 2018 1:30pm - 3:30pm CDT
Room 44