Chair: *Andrew Mawer, NXP Semiconductors Co-Chair: Sue Teng, Cisco
>>Evaluation of High Speed Plating for Copper Post with Flat Top Shape and Improved Post Height Uniformity Yuki Itakura, Shinji Tachibana; Hisamitsu Yamamoto; Shigeo Hashimoto, C. Uyemura & Co., Ltd.
>>Metallization of Glass Interposers *Charles Woychik, Ph.D., John Lauffer, David Bajkowski, Michael Gaige, Robert Edwards, Gordon Benninger, William Wilson, i3 Electronics
>>Development of High Density Interconnect Technologies for Panel Level Packaging *Lars Boettcher, Ph.D., Fraunhofer IZM
Tuesday October 16, 2018 11:00am - 12:30pm CDT
Room 44
