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Tuesday, October 16 • 11:00am - 12:30pm
APT1: Trends in Advanced Packaging / 3D Interconnects

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Chair: *Andrew Mawer, NXP Semiconductors
Co-Chair: Sue Teng, Cisco

>>Evaluation of High Speed Plating for Copper Post with Flat Top Shape and Improved Post Height Uniformity
Yuki Itakura, Shinji Tachibana; Hisamitsu Yamamoto; Shigeo Hashimoto, C. Uyemura & Co., Ltd.

>>Metallization of Glass Interposers
*Charles Woychik, Ph.D., John Lauffer, David Bajkowski, Michael Gaige, Robert Edwards, Gordon Benninger, William Wilson, i3 Electronics

>>Development of High Density Interconnect Technologies for Panel Level Packaging
*Lars Boettcher, Ph.D., Fraunhofer IZM


Tuesday October 16, 2018 11:00am - 12:30pm CDT
Room 44